产品代码 : 3D-Cu-CU-PO1
We provide spherical copper powder with high purity hypoxia, high sphericity, smooth surface, no satellite, uniform particle size distribution, excellent flow performance, and high loose density and vibrational density. Copper has the advantages of low resistivity, low electromigration speed, and low price. It is one of the ideal substitutes for silver-palladium internal electrodes. It is widely used in conductive slurry, cemented carbide additives, conductive coatings and other industries.
Synonyms:
Cu spherical particles, copper spherical powder
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Spherical Copper Powder Characteristics
High purity (99.9% min.)
Low oxygen (can be less than 500 ppm)
High sphericity (90% min.)
Smooth surface, no satellite
Uniform particle size distribution, excellent flowability (Hall Flow Rate ≤25.0 s/50 g)
High bulk density (≥4.2 g/cm3) and tap density (≥ 5.1 g/cm3)
Spherical Copper Powder Particle Size
0-15μm, 5-25μm, 15-45μm, 15-53μm, 45-75μm, 45-105μm, 45-150μm, 75-150μm.
(Various granularities can be customized according to customer requirements)
Spherical Copper Powder Applicable processes
Laser/electron beam additive manufacturing (SLM/EBM, 3D printing)
Direct laser deposition (DLD)
Powder hot isostatic pressing (HIP)
Metal injection molding (MIM)
Powder metallurgy (PM)
Laser cladding (LC), etc.
Spherical Copper Powder Chemical Composition
| Chemical Composition by ICP-AES: | Wt % |
| Cu | Remainder |
| Fe | ＜0.01 |
| Al | ＜0.01 |
| Ca | ＜0.001 |
| Mo | ＜0.001 |
| Si | ＜0.005 |
| Ni | ＜0.01 |
| Mg | ＜0.01 |
| Gas Impurities | |
| O | ≤0.05 |
| N | ≤0.008 |
| C | ≤0.001 |
Spherical Copper Powder Physical Properties
| Form: | Powder | ||
| Color: | Brown | ||
| Melting Point: | 1083°C | ||
| Boiling Point: | 2567°C | ||
| Density: | 8.94 g/cm3 | ||
| Density (g/cm3) | Hall Flow Rate (s/50g) | ||
| Apparent Density | Tap Density | Value | |
| >4.2 | >5.1 | </= 25.0 | |
Spherical Copper Powder Particle Size Description
● 0-15μm (D10=3~5μm, D50=6~10μm, D90=12~14μm)
● 5-25μm (D10=5~10μm, D50=15~20μm, D90=20~25μm)
● 15-45μm (D10=15~20μm, D50=25~30μm, D90=35~40μm)
● 15-53μm (D10=15~20μm, D50=25~35μm, D90=45~50μm)
● 45-75μm (D10=45~55μm, D50=55~65μm, D90=70~75μm)
● 45-105μm (D10=50~60μm, D50=75~85μm, D90=95~105μm)
● 45-150μm (D10=55~70μm, D50=110~120μm, D90=140~150μm)
● 75-150μm (D10=80~90μm, D50=110~125μm, D90=135~150μm)
(Various granularities can be customized according to customer requirements)
Spherical Copper Powder Packaging
Standard Packing: Vacuum packaging, 1 kg/bag or 2 kg/bag. Iron drums lined with a plastic bag, 25 kg/drum. Special package is available on request.
Chemical Identifiers
| Linear Formula | Cu |
| CAS | 7440-50-8 |
| MDL Number | MFCD00010965 |
| EC No. | 231-159-6 |
| Beilstein/Reaxys No. | N/A |
| Pubchem CID | 23978 |
| SMILES | [Cu] |
| InchI Identifier | InChI=1S/Cu |
| InchI Key | RYGMFSIKBFXOCR-UHFFFAOYSA-N |
